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WINSYS is part of ICETE, the 13th International Joint Conference on e-Business and Telecommunications.
Registration to WINSYS allows free access to all other ICETE conferences.


ICETE 2016 will be held in conjunction with PECCS 2016 and PhyCS 2016.

Registration to ICETE allows free access to the PECCS and PhyCS conferences (as a non-speaker).

 

Upcoming Deadlines

Regular and Position Paper Camera Ready and Registration: June 2, 2016
The purpose of WINSYS 2016, the International Conference on Wireless Networks and Mobile Systems, is to bring together researchers, engineers and practitioners interested on information systems and applications in the context of wireless networks and mobile technologies.
Information systems and information technology are pervasive in the whole communications field, which is quite vast, encompassing a large number of research topics and applications: from practical issues to the more abstract theoretical aspects of communication; from low level protocols to high-level networking and applications; from wireless networking technologies to mobile information systems; many other topics are included in the scope of WINSYS.

Conference Chair

Mohammad S. ObaidatFordham University, United States

PROGRAM CHAIR

Pascal LorenzUniversity of Haute Alsace, France

Keynote Lectures

Hamid AghvamiKing's College London, United Kingdom
Giuseppe BianchiUniversity of Roma Tor Vergata, Italy
Anastasios EconomidesUniversity of Macedonia, Greece
Erina FerroCNR-ISTI, Italy
Mateo ValeroUniversidad Politecnica de Catalunya, Spain

Workshops

Doctoral Consortium

Chair: Maria Paula Queluz
Registration: June 9, 2016
Registration: June 9, 2016
 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library


It is planned to publish a short list of revised and
extended versions of presented papers with Springer
in a CCIS Series book

Technically Co-sponsored by:

IEEE   IEEE Systems Council  


In Cooperation with:

ITG   ISSA  


Proceedings will be submitted for indexation by:

DBLP   Thomson   INSPEC   EI   SCOPUS  

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