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WINSYS is part of ICETE, the 10th International Joint Conference on e-Business and Telecommunications.
Registration to WINSYS allows free access to all other ICETE conferences.


ICETE 2013 will be held in conjunction with DATA 2013, ICSOFT 2013 and SIMULTECH 2013.

Registration to ICETE allows free access to the DATA, ICSOFT and SIMULTECH conferences (as a non-speaker).


 
The purpose of WINSYS 2013, the International Conference on Wireless Information Networks and Systems, is to bring together researchers, engineers and practitioners interested on information systems and applications in the context of wireless networks and mobile technologies.
Information systems and information technology are pervasive in the whole communications field, which is quite vast, encompassing a large number of research topics and applications: from practical issues to the more abstract theoretical aspects of communication; from low level protocols to high-level networking and applications; from wireless networking technologies to mobile information systems; many other topics are included in the scope of WINSYS.

Conference Chair

Mohammad S. ObaidatFordham University, United States

PROGRAM CO-CHAIRS

Mohammad S. ObaidatFordham University, United States
Hong JiBeijing University of Post and Telecommunications (BUPT), China
Petros NicopolitidisAristotle University, Greece
Dimitrios D. VergadosUniversity of Piraeus, Greece

Keynote Speakers

Laurence T. YangHuazhong University of Science and Technology, China and St Francis Xavier University, Canada
Pascal LorenzUniversity of Haute Alsace, France
Donal O'MahonyTrinity College Dublin, Ireland
David NaccacheEcole Normale Superieure, France
 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library



A short list of presented papers will be selected so that 
revised and extended versions of these papers will be
published by Springer-Verlag in a CCIS Series book

Technically Co-sponsored by:

IEEE   IEEE Systems Council  


Proceedings will be submitted for indexation by:

Thomson   INSPEC   DBLP   EI   SCOPUS  


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